DocumentCode :
769572
Title :
Applicability and correction of temperature-voltage relation in the case of line contact
Author :
Sano, Yasuo ; Kaneko, Toshinobu
Author_Institution :
Fac. of Sci. & Eng., Sci. Univ. of Tokyo, Japan
Volume :
19
Issue :
1
fYear :
1996
fDate :
3/1/1996 12:00:00 AM
Firstpage :
113
Lastpage :
121
Abstract :
Contact temperature is one of the important factors in contact problems. The temperature-voltage relation is simple to use and applicable for temperature measurement in study, design, and use. In this relation, however, it is assumed that a contact has equivalent distributions between electric potential and temperature within it. If heat is transferred into the external atmosphere through the apparent contact surfaces and/or the contact faces, the relation may not be valid because of the disagreement between the two distributions. In this work, we take a line contact as an example and numerically analyze the effect of the heat transfer on the relation by using the finite difference method. The numerical computations are carried out using the values of electrical resistivity and thermal conductivity for Cu, which are assumed to be temperature-independent. The results show that the effect cannot be neglected under some conditions, We have also clarified the effect in terms of the correction factor, by which one cannot only establish the applicability of the relation, but also correct the theoretical values obtained from the relation. For this reason one can evaluate the effect without losing the simplicity and applicability of the relation
Keywords :
copper; electrical contacts; finite difference methods; heat radiation; natural convection; thermal conductivity; Cu; apparent contact surfaces; contact faces; contact temperature; correction factor; electrical resistivity; finite difference method; heat transfer; line contact; temperature-voltage relation; thermal conductivity; Atmosphere; Contacts; Electric potential; Electric resistance; Finite difference methods; Heat transfer; Temperature distribution; Temperature measurement; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/95.486622
Filename :
486622
Link To Document :
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