Title :
Miniaturized CBCPW bandpass filter basedon thin film polyimide on lossy silicon
Author :
Sang-No Lee ; Joon-Ik Lee ; Yong-Jun Kim ; Jong-Gwan Yook
Author_Institution :
Sch. of Mech. Eng., Yonsei Univ., Seoul
Abstract :
This letter reports a miniaturized conductor-backed coplanar waveguide (CBCPW) bandpass filter (BPF) based on a thin film polyimide layer coated on a lossy silicon. With a 20-mum-thick polyimide interface layer and back metallization, the interaction of electromagnetic fields with the lossy silicon substrate has been isolated, and as a result low-loss and low-dispersive CBCPW line has been obtained. The measured attenuation at 20GHz is below 1.2dB/cm, which is comparable with the CPW fabricated on GaAs. In addition, by using the proposed CBCPW geometry, a miniaturized Ku-band BPF was designed and its measured frequency response demonstrated excellent correlation with the predicted value which validated the performance of the proposed CBCPW geometry used for radio frequency integrated circuit interconnects and filter applications
Keywords :
III-V semiconductors; band-pass filters; coplanar waveguide components; gallium arsenide; microwave filters; waveguide filters; 20 GHz; 20 micron; CBCPW; CMOS-grade silicon; GaAs; Ku-band; RFIC; bandpass filter; conductor-backed coplanar waveguide; filter applications; integrated circuit interconnects; lossy silicon; radio frequency integrated circuits; thin film polyimide back metallization; Band pass filters; Computational geometry; Coplanar waveguides; Electromagnetic fields; Electromagnetic waveguides; Metallization; Polyimides; Semiconductor thin films; Silicon; Substrates; Bandpass filter (BPF); CMOS-grade silicon; conductor-backed coplanar waveguide (CBCPW); radio frequency integrated circuits (RFICs); thin film polyimide;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2006.882396
