DocumentCode
770598
Title
Design of CMOS Transistors to Maximize Circuit FOM Using a Coupled Process and Mixed-Mode Simulation Methodology
Author
Venugopal, R. ; Chakravarthi, S. ; Chidambaram, P.R.
Author_Institution
Silicon Technol. Dev., Texas Instruments, Dallas, TX
Volume
27
Issue
10
fYear
2006
Firstpage
863
Lastpage
865
Abstract
Calibrated process and device CMOS modules were integrated into a mixed-mode simulation setup to study the circuit figure of merit (FOM). Switching delay from typical two-input NAND, two-input NOR, and inverter circuits built and simulated in the device simulator Dessis, including both intra and intercell capacitances and resistances show strong dependence on the drain-induced barrier lowering and associated short-channel electrostatics. The analysis presented in this letter identifies, for a given set of leakage and process constraints, an optimal gate length (Lg) that maximizes circuit FOM. The analysis also highlights, for the first time, that the optimal Lg for maximizing circuit FOM is much longer than that required for maximizing the device performance. The optimal Lg for maximum circuit FOM is determined by a complex tradeoff between reduced capacitance, increased short-channel effect, and reduced mobility
Keywords
MOSFET; NAND circuits; NOR circuits; semiconductor device models; CMOS transistors; Dessis; coupled process; device CMOS modules; drain-induced barrier lowering; inverter circuits; mixed-mode simulation methodology; short-channel effect; short-channel electrostatics; switching delay; two-input NAND circuit; two-input NOR circuit; CMOS process; Capacitance; Circuit optimization; Circuit simulation; Coupling circuits; Electrostatics; Leakage current; MOS devices; Semiconductor process modeling; Threshold voltage; Circuit; figure of merit (FOM); transistor scaling;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2006.882565
Filename
1704924
Link To Document