DocumentCode :
771060
Title :
Influence of internal mechanical stress and strain on electrical performance of polyethylene electrical treeing resistance
Author :
David, E. ; Parpal, J.-L. ; Crine, J.-P.
Author_Institution :
Inst. de Recherche, Hydro-Quebec, Varennes, Que., Canada
Volume :
3
Issue :
2
fYear :
1996
fDate :
4/1/1996 12:00:00 AM
Firstpage :
248
Lastpage :
257
Abstract :
Crosslinked polyethylene (XLPE) and low-density polyethylene (LDPE) insulations used in HV cables are not only subjected to electrical and thermal stresses, but also exposed to mechanical stresses, whether residual internal stresses created during the cooling process of the fabrication, external forces when cables are bent during installation or thermomechanical stresses caused by differential thermal expansion between the conductor and the polymeric material. In order to investigate the possible influence of mechanical stresses on dielectric properties of polyethylene, measurements were conducted on pin-plane XLPE and LDPE samples with various magnitudes of residual mechanical stresses around the embedded electrode. The time to inception, the growing rate and the shape of the electrical trees under different voltages are reported in this paper. Specimens with the highest values of residual stresses were found to have the shortest inception times and the longest trees after one hour of aging under different voltages. When the mechanical stress was allowed to relax, the treeing resistance was measured to be significantly improved
Keywords :
XLPE insulation; ageing; internal stresses; polyethylene insulation; power cable insulation; power cables; thermal expansion; trees (electrical); HV cables; LDPE; XLPE; aging; cooling process; differential thermal expansion; electrical performance; electrical treeing resistance; external forces; growing rate; internal mechanical stress; pin-plane samples; thermomechanical stresses; time to inception; Capacitive sensors; Conducting materials; Internal stresses; Mechanical cables; Polyethylene; Residual stresses; Thermal conductivity; Thermal expansion; Thermal force; Thermal stresses;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/94.486777
Filename :
486777
Link To Document :
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