Title :
Small planar packaging system for high-throughput ATM switching systems
Author :
Kishimoto, T. ; Yasuda, K. ; Oka, H. ; Kaneko, Y. ; Kawauchi, M.
Author_Institution :
NTT Network Service Syst. Labs., Tokyo, Japan
fDate :
3/30/1995 12:00:00 AM
Abstract :
A small planar packaging (SPP) system is described that can be combined with card-on-board (COB) packaging in ATM switching systems with throughputs of over 40 Gbit/s. Using a newly developed quasicoaxial zero-insertion-force connector, point-to-point 311 Mbit/s of 8 bit parallel signal transmission is achieved in an arbitrary location on the SPP system´s shelf. Also 5400 I/O connections in the region of the planar packaging system are made, and thus the SPP system eliminates the I/O pin count limitation. Furthermore, the heat flux of the SPP system is five times higher than that of conventional COB packaging because of its air flow control structure
Keywords :
B-ISDN; asynchronous transfer mode; electric connectors; electronic switching systems; packaging; 40 to 311 Gbit/s; ATM switching systems; COB packaging; air flow control structure; card-on-board packaging; heat flux; high-throughput switching systems; planar packaging; quasicoaxial ZIF connector; small planar packaging system; zero-insertion-force connector;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19950386
