Bonding of silicon with filled and unfilled polymers based on black silicon

A bonding method for silicon wafers with unfilled and filled polymer components using `Black Silicon´ is presented. The working principle is an interconnection of `Black Silicon´ surfaces with ductile materials. Needles of nanostructured `Black Silicon´ with their increased surface and undercut features penetrate the polymer when applying pressure. Plastic deformations of the polymer lead to a permanent bond. The retention force exceeds 1000 N/cm² as experiments with polypropylene and low temperature co-fired ceramic tapes (polymer filled with ceramic) show. The application areas are smart packaging, fluidic interconnects for microsystems, electronic assembly and hybrid polymer-ceramic silicon systems