Title :
Integration of Niobium Low-Temperature-Superconducting RF Circuits With Gold-Based RF MEMS Switches
Author :
Attar, Sara S. ; Masnour, Raafat R.
Author_Institution :
Univ. of Waterloo, Waterloo, ON, Canada
Abstract :
A novel eight-mask fabrication process for the integration of low-temperature-superconducting niobium (Nb) RF circuits with gold-based RF microelectromechanical system (MEMS) switches is proposed. DC-contact and capacitive-contact RF MEMS switches integrated with Nb-based transmission lines are presented for the first time. A comparison of the RF performance of the switches at room and cryogenic temperatures indicate that the proposed gold-based MEMS fabrication process did have a major impact on the superconducting characteristics of Nb. A switched capacitor bank is also designed, implementing a dc-contact RF MEMS switch. The measured results of the capacitor bank show the variation of the capacitance value from 0.22 to 5.25 pF at 4 K. A thermal analysis of the devices under test (DUTs) is also performed, and an investigation is carried out to minimize the thermal loss between the chuck and the DUT.
Keywords :
cryogenic electronics; gold; masks; microswitches; niobium; radiofrequency integrated circuits; superconducting integrated circuits; switched capacitor networks; thermal analysis; transmission lines; Au; DC-contact RF MEMS switches; DUT; MEMS fabrication process; Nb; RF microelectromechanical system switches; capacitance 0.22 pF to 5.25 pF; capacitive-contact RF MEMS switches; cryogenic temperatures; devices under test; eight-mask fabrication process; gold; low-temperature-superconducting RF circuits; niobium; superconducting characteristics; switched capacitor bank; temperature 4 K; thermal analysis; thermal loss; transmission lines; Cryogenics; Gold; Microswitches; Niobium; Radio frequency; Substrates; Capacitor bank; cryogenics; micro-electromechanical- systems; microelectromechanical systems (MEMSs); radio frequency; radio frequency (RF); switches;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2014.2364453