DocumentCode :
772834
Title :
Efficient mixed-domain analysis of electrostatic MEMS
Author :
Li, Gang ; Aluru, N.R.
Author_Institution :
Dept. of Mech. & Ind. Eng., Univ. of Illinois, Urbana-Champaign, IL, USA
Volume :
22
Issue :
9
fYear :
2003
Firstpage :
1228
Lastpage :
1242
Abstract :
We present efficient computational methods for scattered point and meshless analysis of electrostatic microelectromechanical systems (MEMS). Electrostatic MEM devices are governed by coupled mechanical and electrostatic energy domains. A self-consistent analysis of electrostatic MEMS is implemented by combining a finite cloud method-based interior mechanical analysis with a boundary cloud method (BCM)-based exterior electrostatic analysis. Lagrangian descriptions are used for both mechanical and electrostatic analyses. Meshless finite cloud and BCMs, combined with fast algorithms and Lagrangian descriptions, are flexible, efficient, and attractive alternatives compared to conventional finite element/boundary element methods for self-consistent electromechanical analysis. Numerical results are presented for MEM switches, a micromirror device, a lateral comb drive microactuator, and an electrostatic comb drive device. Simulation results are compared with experimental and previously reported data for many of the examples discussed in this paper and a good agreement is observed.
Keywords :
electrostatic devices; micromechanical devices; Lagrangian algorithm; MEM switch; boundary cloud method; computational method; coupled electromechanical analysis; electrostatic MEMS; electrostatic comb drive device; finite cloud method; lateral comb drive microactuator; meshless analysis; micromirror device; mixed-domain analysis; scattered point analysis; self-consistent analysis; Algorithm design and analysis; Boundary element methods; Clouds; Electrostatic analysis; Finite element methods; Lagrangian functions; Microelectromechanical systems; Micromechanical devices; Scattering; Switches;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2003.816210
Filename :
1225814
Link To Document :
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