Shielding effect of a diaphragm in a packaged microstrip circuit

Author

Chen, Hao-Hui ; Chung, Shyh-Jong

Author_Institution

Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

Volume

43

Issue

5

fYear

1995

fDate

5/1/1995 12:00:00 AM

Firstpage

1082

Lastpage

1086

Abstract

The scattering of a diaphragm in a packaged microstrip line is investigated using the mode-matching method together with the method of lines. Instead of analyzing the discontinuity in the microstrip, this paper tackles the variation of the waveguide housing. The influences of the thickness and the depth of the diaphragm on the scatterings of the dominant mode and higher-order modes are analyzed based on a comparison of the modal power distributions. Finally, the shielding effect of a pair of closely spaced diaphragms is investigated

Keywords

MMIC; electromagnetic shielding; integrated circuit design; integrated circuit packaging; microstrip circuits; mode matching; MMIC; diaphragm; dominant mode; higher-order modes; method of lines; modal power distributions; mode-matching method; packaged microstrip circuit; shielding effect; waveguide housing; Distributed parameter circuits; Electromagnetic scattering; Electromagnetic waveguides; Microstrip; Microwave circuits; Mode matching methods; Packaging; Power transmission lines; Transmission line discontinuities; Transmission line theory;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.382069

Filename

382069