• DocumentCode
    773494
  • Title

    Generalized coupled interconnect transfer function and high-speed signal simulations

  • Author

    Eo, Yungseon ; Eisenstadt, William R.

  • Author_Institution
    Dept. of Electr. Eng., Hanyang Univ., Ansan, South Korea
  • Volume
    43
  • Issue
    5
  • fYear
    1995
  • fDate
    5/1/1995 12:00:00 AM
  • Firstpage
    1115
  • Lastpage
    1121
  • Abstract
    A new expression for the coupled interconnect system transfer function has been derived under general linear generator and uncoupled load conditions, i.e., without any restrictions in circuit load impedance. High-speed-signals on coupled interconnects have been simulated using this transfer function. The simulation uses generalized interconnect circuit model parameters in which all line parameters are frequency dependent. The validity of the interconnect circuit parameters was confirmed previously using s-parameter measurements. High-speed signal simulation using this novel interconnect transfer function has been verified with time-domain measurements using an HP54121T high-speed sampling oscilloscope. This work accurately predicts coupled interconnect circuit responses. With this transfer function, signal integrity problems of high-performance VLSI circuits can be predicted in the design stage
  • Keywords
    VLSI; circuit analysis computing; integrated circuit interconnections; transfer functions; HP54121T high-speed sampling oscilloscope; VLSI circuits; circuit parameters; coupled interconnect system; design; high-speed signal simulations; linear generator; signal integrity; time-domain measurements; transfer function; uncoupled load; Circuit simulation; Coupling circuits; Frequency dependence; Impedance; Integrated circuit interconnections; Oscilloscopes; Sampling methods; Scattering parameters; Time domain analysis; Transfer functions;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.382074
  • Filename
    382074