• DocumentCode
    773649
  • Title

    An interconnect energy model considering coupling effects

  • Author

    Uchino, Taku ; Cong, Jason

  • Author_Institution
    STI-Design Center, Toshiba America Electron. Components, Austin, TX, USA
  • Volume
    21
  • Issue
    7
  • fYear
    2002
  • fDate
    7/1/2002 12:00:00 AM
  • Firstpage
    763
  • Lastpage
    776
  • Abstract
    This paper presents an analytical interconnect energy model with consideration of coupling effects, including crosstalk and glitch, which are not adequately considered by the conventional (1/2) CV2 model. The energy model introduces a new timescale parameter, called the charge time, which represents the correlation time length between two events and is considered to be the counterpart of the Elmore delay. The authors´ energy model is more accurate than the (1/2) CV2 model with the same time complexity. Experimental results show that their algorithm is several orders of magnitude faster than HSPICE with less than 5% error. In comparison, the error of the (1/2) CV2 model can be as high as 100%. The authors further investigate the relationship between interconnect energy and signal correlation and propose a simplified model, which is even faster than their basic model. This paper also discusses ongoing issues of their model, including stability analysis, event propagation, and resistive shielding effects in interconnect energy calculation
  • Keywords
    crosstalk; integrated circuit interconnections; integrated circuit modelling; (1/2) CV2 model; Elmore delay; HSPICE; analytical model; charge time; coupling effects; crosstalk; event propagation; glitch; interconnect energy; power estimation; resistive shielding; signal correlation; stability analysis; Analytical models; Capacitance; Coupling circuits; Crosstalk; Delay estimation; Integrated circuit interconnections; Mutual coupling; Power system interconnection; Power system modeling; Power system reliability;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2002.1013890
  • Filename
    1013890