Title :
A New Head Phantom With Realistic Shape and Spatially Varying Skull Resistivity Distribution
Author :
Jian-Bo Li ; Chi Tang ; Meng Dai ; Geng Liu ; Xue-Tao Shi ; Bin Yang ; Can-Hua Xu ; Feng Fu ; Fu-Sheng You ; Meng-Xing Tang ; Xiu-Zhen Dong
Author_Institution :
Dept. of Biomed. Eng., Fourth Mil. Med. Univ., Xi´an, China
Abstract :
Brain electrical impedance tomography (EIT) is an emerging method for monitoring brain injuries. To effectively evaluate brain EIT systems and reconstruction algorithms, we have developed a novel head phantom that features realistic anatomy and spatially varying skull resistivity. The head phantom was created with three layers, representing scalp, skull, and brain tissues. The fabrication process entailed 3-D printing of the anatomical geometry for mold creation followed by casting to ensure high geometrical precision and accuracy of the resistivity distribution. We evaluated the accuracy and stability of the phantom. Results showed that the head phantom achieved high geometric accuracy, accurate skull resistivity values, and good stability over time and in the frequency domain. Experimental impedance reconstructions performed using the head phantom and computer simulations were found to be consistent for the same perturbation object. In conclusion, this new phantom could provide a more accurate test platform for brain EIT research.
Keywords :
bioelectric phenomena; brain; electric impedance imaging; injuries; phantoms; 3D printing; anatomical geometry; brain EIT systems; brain electrical impedance tomography; brain injury monitoring; brain tissue; casting; geometrical precision; head phantom shape; impedance reconstruction; mold creation; realistic anatomy; reconstruction algorithms; resistivity distribution accuracy; scalp tissue; spatially varying skull resistivity distribution; Conductivity; Current measurement; Phantoms; Resins; Shape; Skull; Electrical impedance tomography (EIT); heterogeneous resistivity distribution; phantom; rapid prototyping (RP); realistic shape;
Journal_Title :
Biomedical Engineering, IEEE Transactions on
DOI :
10.1109/TBME.2013.2288133