DocumentCode :
773728
Title :
High-level test compaction techniques
Author :
Ravi, Srivaths ; Lakshminarayana, Ganesh ; Jha, Niraj K.
Author_Institution :
C&C Res. Labs., NEC, Princeton, NJ, USA
Volume :
21
Issue :
7
fYear :
2002
fDate :
7/1/2002 12:00:00 AM
Firstpage :
827
Lastpage :
841
Abstract :
Available register-transfer level (RTL) test generation techniques do not make a concerted effort to reduce the test application time associated with the derived tests. Chip tester memory limitations, increasing tester costs, etc., make it imperative that the issue of generating compact tests at the RTL be addressed and consolidated with the known gains of high-level testing. In this paper, the authors provide a comprehensive framework for generating compact tests for an RTL circuit. They develop a series of techniques that exploit the inherent parallelism available in symbolic test(s) derived for RTL module(s). These techniques enable them to schedule testing of multiple modules in parallel as well as perform test pipelining. In addition, the authors also present design for testability (DFT) techniques for lowering test application time. Using a maximum bipartite matching formulation, they choose a low-overhead set of test enhancements that can achieve compact tests. The authors´ techniques can seamlessly plug into any generic high-level test framework. Their experimental results in the context of one such framework indicate that the proposed methodology achieves an average reduction in test application time of 54.2% for the example circuits
Keywords :
design for testability; logic testing; RTL circuit; RTL test generation; design for testability; high-level test compaction; maximum bipartite matching; symbolic testing; test application time; test pipelining; Automatic test pattern generation; Automatic testing; Circuit faults; Circuit testing; Compaction; Costs; Design for testability; Investments; Manufacturing; Performance evaluation;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2002.1013895
Filename :
1013895
Link To Document :
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