DocumentCode :
774773
Title :
An interactive VLSI CAD tool for yield estimation
Author :
Wagner, Israel A. ; Koren, Israel
Author_Institution :
IBM Israel Sci. & Technol. Center, Haifa, Israel
Volume :
8
Issue :
2
fYear :
1995
fDate :
5/1/1995 12:00:00 AM
Firstpage :
130
Lastpage :
138
Abstract :
The yield of a VLSI chip depends on the sensitivity of the chip to defects occurring during the fabrication process, among other factors. To predict this sensitivity, one usually needs to compute the so-called critical area (Ac), which reflects how many and how large the defects must be in order to result in a circuit failure. The main computational problem in yield estimation is to calculate Ac efficiently for complicated, irregular layouts. A novel approach is suggested for this problem that results in an algorithm that will solve it efficiently. This paper provides an interactive, accurate, and fast method for the evaluation of critical area as a design tool; the tool utilizes good visual feedback to allow layout improvement for higher yield. The algorithm is compared to other yield-prediction methods, which use either the Monte Carlo approach (VLASIC) or a deterministic approach (SCA); the algorithm is shown to be faster. It also has the advantage that it can graphically show a detailed `defect sensitivity map´ that can assist a chip designer in improving the yield of his/her layout
Keywords :
VLSI; circuit layout CAD; integrated circuit layout; integrated circuit yield; interactive systems; sensitivity analysis; IC layout; VLSI chip yield; critical area; defect sensitivity map; interactive VLSI CAD tool; visual feedback; yield estimation; yield prediction method; Algorithm design and analysis; Circuits; Computer aided manufacturing; Fabrication; Feedback; Layout; Manufacturing processes; Monte Carlo methods; Very large scale integration; Yield estimation;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.382276
Filename :
382276
Link To Document :
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