• DocumentCode
    774773
  • Title

    An interactive VLSI CAD tool for yield estimation

  • Author

    Wagner, Israel A. ; Koren, Israel

  • Author_Institution
    IBM Israel Sci. & Technol. Center, Haifa, Israel
  • Volume
    8
  • Issue
    2
  • fYear
    1995
  • fDate
    5/1/1995 12:00:00 AM
  • Firstpage
    130
  • Lastpage
    138
  • Abstract
    The yield of a VLSI chip depends on the sensitivity of the chip to defects occurring during the fabrication process, among other factors. To predict this sensitivity, one usually needs to compute the so-called critical area (Ac), which reflects how many and how large the defects must be in order to result in a circuit failure. The main computational problem in yield estimation is to calculate Ac efficiently for complicated, irregular layouts. A novel approach is suggested for this problem that results in an algorithm that will solve it efficiently. This paper provides an interactive, accurate, and fast method for the evaluation of critical area as a design tool; the tool utilizes good visual feedback to allow layout improvement for higher yield. The algorithm is compared to other yield-prediction methods, which use either the Monte Carlo approach (VLASIC) or a deterministic approach (SCA); the algorithm is shown to be faster. It also has the advantage that it can graphically show a detailed `defect sensitivity map´ that can assist a chip designer in improving the yield of his/her layout
  • Keywords
    VLSI; circuit layout CAD; integrated circuit layout; integrated circuit yield; interactive systems; sensitivity analysis; IC layout; VLSI chip yield; critical area; defect sensitivity map; interactive VLSI CAD tool; visual feedback; yield estimation; yield prediction method; Algorithm design and analysis; Circuits; Computer aided manufacturing; Fabrication; Feedback; Layout; Manufacturing processes; Monte Carlo methods; Very large scale integration; Yield estimation;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.382276
  • Filename
    382276