DocumentCode
774786
Title
15-gb/s bit-interleaved optical backplane bus using volume photopolymer holograms
Author
Bi, Hai ; Han, Xuliang ; Xiaonan Chen ; Jiang, Wei ; Choi, Jinho ; Chen, Ray T.
Author_Institution
Microelectron. Res. Center, Austin, TX
Volume
18
Issue
20
fYear
2006
Firstpage
2165
Lastpage
2167
Abstract
A 15-Gb/s bit-interleaved optical backplane bus interconnection is experimentally demonstrated in a three-board system based on optical backplane using volume photopolymer holograms. During upstream data transferring, bit pulses from each daughter board are superposed to form an interleaved sequence while for downstream data transferring, the data broadcast from the central board are time-division demultiplexed locally at each daughter board, and only the destined bits are stored respectively. In this way, slow electronic chips can be coordinated to generate a high aggregated bandwidth to relieve wiring congestion. Both nonreturn-to-zero and return-to-zero signaling modes based on vertical-cavity surface-emitting laser sources and pulse lasers are independently employed to implement 2.5- and 15-Gb/s operations. This optical bus architecture also provides a secure and reliable data storage method at 850 nm with a bit-error rate better than 10-12
Keywords
error statistics; holographic storage; interleaved storage; optical backplanes; optical modulation; optical polymers; reliability; time division multiplexing; 15 Gbit/s; 850 nm; bit interleaving; bit-error rate; data storage; nonreturn-to-zero signal; optical backplane bus interconnection; return-to-zero signal; time-division demultiplexing; upstream data transferring; vertical-cavity surface-emitting laser; volume photopolymer holograms; Backplanes; Bandwidth; Broadcasting; Laser modes; Memory; Optical interconnections; Optical pulses; Surface emitting lasers; Vertical cavity surface emitting lasers; Wiring; Bit-interleaved optical backplane (BIOB) bus; reliability; volume photopolymer holograms;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2006.883175
Filename
1705519
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