DocumentCode :
774851
Title :
Yield-oriented computer-aided defect diagnosis
Author :
Khare, Jitendra B. ; Maly, Wojciech ; Griep, Susanne ; Schmitt-Landsiedel, Doris
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume :
8
Issue :
2
fYear :
1995
fDate :
5/1/1995 12:00:00 AM
Firstpage :
195
Lastpage :
206
Abstract :
Any good yield-oriented defect strategy must have two main components-(a) the ability to perform rapid defect diagnosis for yield learning, and (b) the ability to efficiently extract defect parameters from the manufacturing line. In this work, an inductive fault analysis (IFA)-based defect methodology is investigated to see if it meets the above requirements. Using an SRAM test vehicle as an example, the research analyzes whether computer-generated mappings between defect types and tester fail data can provide sufficient resolution for both, defect diagnosis and defect parameter characterization
Keywords :
SRAM chips; failure analysis; fault diagnosis; integrated circuit testing; integrated circuit yield; semiconductor process modelling; SRAM test vehicle; computer-aided defect diagnosis; computer-generated mappings; defect methodology; defect parameters; fail data; inductive fault analysis; manufacturing line; yield learning; Data mining; Dictionaries; Fabrication; Failure analysis; Logic arrays; Manufacturing; Random access memory; Semiconductor device manufacture; Testing; Vehicles;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.382283
Filename :
382283
Link To Document :
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