DocumentCode
774921
Title
Improvement of low-temperature gate dielectric formed in N2O plasma by an additional CF4 pretreatment process
Author
Chang, Tzu Yun ; Lei, Tan Fu ; Chao, Tien Sheng ; Wen, Huang Chun ; Chen, Hsiao Wei
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
23
Issue
7
fYear
2002
fDate
7/1/2002 12:00:00 AM
Firstpage
389
Lastpage
391
Abstract
This study describes a novel technique to form low temperature oxide (<350/spl deg/C). Low-temperature oxides were formed by N/sub 2/O plasma in the plasma-enhanced chemical vapor deposition (PECVD) system with a CF/sub 4/ pretreatment. These oxides demonstrate excellent current-voltage (I-V) characteristics comparable to thermally grown oxides. Experimental results indicate that CF/sub 4/ plasma treatment can significantly improve the reliability of low-temperature oxides. With excellent electrical properties, the technique is highly promising for low-temperature processes.
Keywords
CMOS integrated circuits; MOS capacitors; dielectric thin films; leakage currents; oxidation; plasma CVD; semiconductor device breakdown; silicon compounds; MOS capacitors; Si; SiO/sub 2/; TDDB; current-voltage characteristics; gate oxide integrity; low-temperature gate dielectric; low-temperature processes; plasma-enhanced chemical vapor deposition; replacement gate CMOS application; tetrafluoromethane plasma treatment; thermal oxides; ultrathin gate oxides; wet oxidation; Chaos; Chemical vapor deposition; Dielectric measurements; Insulation; Plasma applications; Plasma chemistry; Plasma devices; Plasma properties; Plasma sources; Plasma temperature;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2002.1015208
Filename
1015208
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