Title :
FLO/STRESS: an integrated software module to predict stress in electronic products
Author :
Bailey, C. ; Warner, M. ; Agha, A. ; Pericleous, K. ; Parry, J. ; Marooney, C. ; Reeves, H. ; Clark, I.
Author_Institution :
Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London, UK
fDate :
6/1/2002 12:00:00 AM
Abstract :
Software technology that predicts stress in electronic systems and packages, developed as part of TCS Programme, is described. The software is closely integrated within a thermal design tool providing the ability to simulate the coupled effects of airflow, temperature and stress on product performance. This integrated approach to analysis will help decrease the number of design cycles.
Keywords :
circuit CAD; circuit analysis computing; electronics industry; mechanical engineering computing; product development; CAD; FLO STRESS software; TCS Programme; airflow; computer-aided analysis; design cycles; electronic product stress prediction; electronics industry; integrated software module; product performance; temperature; thermal design tool;
Journal_Title :
Computing & Control Engineering Journal
DOI :
10.1049/cce:20020306
