Title :
Through-silicon-chip transmission lines
Author :
Ng, K.T. ; Boellaard, E. ; Pham, N.P. ; Burghartz, J.N.
Author_Institution :
Delft Inst. of Microelectron. & Submicron Technol., Delft Univ. of Technol., Netherlands
fDate :
6/20/2002 12:00:00 AM
Abstract :
Through-chip transmission lines connecting the frontside and backside of high-resistivity wafers are fabricated using bulk-micromachining and backside metal patterning. Experimental results illustrate the feasibility of low-loss through-chip microstrips and coplanar waveguides for innovative integration concepts of radio-frequency and microwave systems in silicon technology
Keywords :
coplanar waveguides; micromachining; microstrip lines; Si; backside; backside metal patterning; bulk-micromachining; coplanar waveguides; frontside; high-resistivity wafers; microstrips; microwave systems; radio-frequency systems; through-silicon-chip transmission lines;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20020430
