DocumentCode
77633
Title
Novel Electrode Design for Integrated Thin-Film GaN LED Package With Efficiency Improvement
Author
Yao-Jun Tsai ; Re-Ching Lin ; Hung-Lieh Hu ; Chen-Peng Hsu ; Shih-Yi Wen ; Chi-Chin Yang
Author_Institution
Electron. & Opto-Electron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Volume
25
Issue
6
fYear
2013
fDate
15-Mar-13
Firstpage
609
Lastpage
611
Abstract
This letter proposes a novel electrode structure for thin-GaN LED applications. The structure enhances light extraction and wall-plug efficiency in thin-GaN LEDs. To enhance light extraction in thin-GaN LEDs and solve current crowding effects caused by electrodes composed of metal, conventional n-GaN electrodes were replaced with ITO conductive films because of their high optical transparency. Simulation results show that the thin-GaN LEDs that use ITO as the nonshielded electrode have a more uniform current density distribution on the n-GaN surface and a higher average internal quantum efficiency than conventional metal electrodes. Furthermore, when a current of 200 mA was applied, the thin-GaN LEDs using the proposed electrode had a 40% increase in light-output power and a significant decrease in chip temperature compared to the use of conventional electrodes. The results indicate that the nonshielded ITO electrode design enhances the light extraction efficiency and avoids the accumulation of heat because of its uniform current density distribution.
Keywords
III-V semiconductors; current density; electrodes; gallium compounds; integrated circuit packaging; integrated optics; light emitting diodes; wide band gap semiconductors; GaN; ITO conductive films; LED applications; chip temperature; current 200 mA; current crowding effects; current density distribution; electrode design; electrode structure; high optical transparency; integrated thin-film LED package; internal quantum efficiency; light extraction efficiency; metal electrodes; nonshielded electrode; wall-plug efficiency; Bonding; Electrodes; Indium tin oxide; Light emitting diodes; Metals; Substrates; Wires; LED; nonshielding electrode; thin-film package LED (TFP LED);
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2013.2244078
Filename
6472753
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