DocumentCode :
77651
Title :
Analysis of Charge Deposition and Collection Caused by Low Energy Neutrons in a 25-nm Bulk CMOS Technology
Author :
Abe, Shin-ichiro ; Watanabe, Yoshihiro
Author_Institution :
Dept. of Adv. Energy Eng., Kyushu Univ., Fukuoka, Japan
Volume :
61
Issue :
6
fYear :
2014
fDate :
Dec. 2014
Firstpage :
3519
Lastpage :
3526
Abstract :
Neutron-induced single event upsets (SEUs) in a 25-nm NMOSFET are analyzed using PHYSERD simulation. We confirm that the secondary H and He ions dominate SEUs above the threshold energies of (n,p) and ( n, α) reactions although the production cross sections for H and He ions are smaller than the elastic scattering cross sections below 20 MeV. The SEUs induced by secondary H and He ions are influenced strongly by the size of the interaction volume considered in the simulation because the ranges of H and He ions are much longer than those of elastic recoils.
Keywords :
MOSFET; Monte Carlo methods; neutron effects; radiation hardening (electronics); semiconductor device models; ( n,α) reactions; (n,p) reactions; 25-nm NMOSFET; PHYSERD simulation; bulk CMOS technology; charge deposition analysis; elastic recoils; elastic scattering cross sections; interaction volume size; low energy neutrons; neutron-induced single event upsets; production cross sections; secondary H ions; secondary He ions; threshold energies; CMOS technology; MOSFET circuits; Monte Carlo methods; Neutrons; Radiation effects; Single event upsets; Monte Carlo simulation; PHYSERD; neutrons; single event upset (SEU); terrestrial radiation effects;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2014.2367513
Filename :
6975251
Link To Document :
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