DocumentCode :
776833
Title :
Thermal-ADI - a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method
Author :
Wang, Ting-Yuan ; Chen, Charlie Chung-Ping
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Wisconsin, Madison, WI, USA
Volume :
11
Issue :
4
fYear :
2003
Firstpage :
691
Lastpage :
700
Abstract :
Due to the dramatic increase of clock frequency and integration density, power density and on-chip temperature in high-end very large scale integration (VLSI) circuits rise significantly. To ensure the timing correctness and the reliability of high-end VLSI design, efficient and accurate chip-level transient thermal simulations are of crucial importance. In this paper, we develop and present an efficient transient thermal-simulation algorithm based on the alternating-direction-implicit (ADI) method. Our algorithm, thermal-ADI, not only has a linear run time and memory requirement , but is also unconditionally stable, which ensures that time step is not limited by any stability requirement. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal-simulation algorithms, but also highly accurate and efficient in memory usage.
Keywords :
circuit simulation; integrated circuit modelling; integrated circuit reliability; thermal analysis; timing; transient analysis; alternating-direction-implicit method; chip-level transient thermal simulations; clock frequency; integration density; linear run time; linear-time chip-level dynamic thermal-simulation algorithm; memory requirement; memory usage; on-chip temperature; power density; reliability; thermal-ADI; time step; timing correctness; Circuit simulation; Clocks; Frequency; Heuristic algorithms; Integrated circuit reliability; Temperature; Thermal stability; Timing; VHF circuits; Very large scale integration;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2003.812372
Filename :
1229875
Link To Document :
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