Title :
A 146-mm2 8-gb multi-level NAND flash memory with 70-nm CMOS technology
Author :
Hara, Takahiko ; Fukuda, Koichi ; Kanazawa, Kazuhisa ; Shibata, Noboru ; Hosono, Koji ; Maejima, Hiroshi ; Nakagawa, Michio ; Abe, Takumi ; Kojima, Masatsugu ; Fujiu, Masaki ; Takeuchi, Yoshiaki ; Amemiya, Kazumi ; Morooka, Midori ; Kamei, Teruhiko ; Nasu
Author_Institution :
SoC R&D Center, Toshiba Corp. Semicond. Co., Kanagawa, Japan
Abstract :
An 8-Gb multi-level NAND Flash memory with 4-level programmed cells has been developed successfully. The cost-effective small chip has been fabricated in 70-nm CMOS technology. To decrease the chip size, a one-sided pad arrangement with compacted core architecture and a block address expansion scheme without block redundancy replacement have been introduced. With these methods, the chip size has been reduced to 146 mm2, which is 4.9% smaller than the conventional chip. In terms of performance, the program throughput reaches 6 MB/s at 4-KB page operation, which is significantly faster than previously reported and very competitive with binary Flash memories. This high performance has been achieved by the combination of the multi-level cell (MLC) programming with write caches and with the program voltage compensation technique for neighboring select transistors. The read throughput reaches 60 MB/s using 16I/O configuration.
Keywords :
CMOS memory circuits; NAND circuits; cache storage; compensation; flash memories; memory architecture; multivalued logic circuits; nanotechnology; programmable logic devices; 4-level programmed cells; 70 nm; 8 Gbit; CMOS technology; block address expansion scheme; chip size reduction; compacted core architecture; multi-level NAND flash memory; multi-level cell programming; program voltage compensation technique; write caches; CMOS technology; Cellular phones; Costs; Digital cameras; Flash memory; Handheld computers; History; Throughput; Universal Serial Bus; Voltage; Flash memory; NAND Flash memory; high-speed programming; multi-level cell; pad arrangement;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2005.859027