Title :
3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver
Author :
Luo, Lei ; Wilson, John M. ; Mick, Stephen E. ; Xu, Jian ; Zhang, Liang ; Franzon, Paul D.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
A 120-mVppd low swing pulse receiver is presented for AC coupled interconnect (ACCI). Using this receiver, 3Gb/s chip-to-chip communication is demonstrated through a wire-bonded ACCI channel with 150-fF coupling capacitors, across 15-cm FR4 microstrip lines. A test chip was fabricated in TSMC 0.18-μm CMOS technology and the driver and pulse receiver dissipate 15-mW power per I/O at 3 Gb/s, with a bit error rate less than 10-12. First-time demonstration of a flip-chip ACCI is also presented, with both the AC and DC connections successfully integrated between the flipped chip and the multichip module (MCM) substrate by using the buried bump technology. For the flip-chip ACCI, 2.5 Gb/s/channel communication is demonstrated across 5.6 cm of transmission line on a MCM substrate.
Keywords :
flip-chip devices; integrated circuit interconnections; multichip modules; receivers; 0.18 micron; 120 mV; 15 cm; 15 mW; 2.5 Gbit/s; 3 Gbit/s; 5.6 cm; AC coupled interconnect; CMOS technology; FR4 microstrip lines; MCM substrate; bandlimited communications; buried bump technology; capacitive coupling; chip-to-chip communication; flip-chip ACCI; low swing pulse receiver; multichip module; pulse signaling; CMOS technology; Capacitors; Clocks; Couplings; Microstrip; Multichip modules; Optical signal processing; Power transmission lines; Pulse power systems; Testing; AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2005.859881
