DocumentCode :
777693
Title :
Processing and Characterization of Ni Base Coated Superconductor Substrate Tapes With Layered Architecture
Author :
Bhattacharjee, Pinaki Prasad ; Ray, Ranjit K.
Author_Institution :
Dept. of Adaptive Machine Syst., Osaka Univ., Osaka
Volume :
18
Issue :
3
fYear :
2008
Firstpage :
1704
Lastpage :
1710
Abstract :
Ni/Ni-5 at.%Mo and Ni/Ni-5 at.%Mo/Ni multilayer tapes were prepared from elemental powders by a powder metallurgy route for coated superconductor substrate applications. The development of cube texture ({001}(100)) following heavy cold rolling ( ~95%) and annealing has been studied in the Ni side(s) of these multilayer tapes and compared to a nonalloyed Ni tape. Although the deformation textures in the Ni side(s) of these multilayer tapes appear quite similar to that of the nonalloyed Ni tape cold rolled to a similar deformation level, the volume fraction of the cube grains in the Ni side(s) of the multilayer tapes following annealing shows marked improvement as compared to the nonalloyed Ni tape after different annealing treatments. X-ray area mapping from typical cross-sectional areas of the multilayer compacts in the sintered condition reveals significant diffusion of the alloying element Mo from the alloy side(s) to the Ni side. These facts amply corroborate the earlier observation on the beneficial role of Mo on the development of cube texture in Ni. The yield strength of the annealed multilayer tapes shows marked improvement over nonalloyed Ni tapes.
Keywords :
annealing; deformation; molybdenum alloys; multilayers; nickel alloys; powder metallurgy; superconducting tapes; texture; Ni-NiMoJk; annealing; coated superconductor substrate tapes; cube texture; deformation textures; elemental powders; heavy cold rolling; multilayer tapes; nickel alloys; powder metallurgy; Cube texture; mechanical properties; multilayer substrates; nickel alloys; powder metallurgy;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2008.2000904
Filename :
4555249
Link To Document :
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