• DocumentCode
    777769
  • Title

    Application of defected ground structure in reducing the size of amplifiers

  • Author

    Lim, Jong-Sik ; Park, Jun-Seok ; Lee, Young-Taek ; Ahn, Dal ; Nam, Sangwook

  • Author_Institution
    Appl. Electromagn. Lab., Seoul Nat. Univ., South Korea
  • Volume
    12
  • Issue
    7
  • fYear
    2002
  • fDate
    7/1/2002 12:00:00 AM
  • Firstpage
    261
  • Lastpage
    263
  • Abstract
    This letter presents a new technique to reduce the size of microwave amplifiers using a defected ground structure (DGS). The DGS on the ground plane of a microstrip line provides an additional effective inductive component, which enables a microstrip line with very high impedance to be realized and shows slow-wave characteristics. The resultant electrical length of the microstrip line with DGS is longer than that of a conventional line for the same physical length. Therefore, the microstrip line with DGS can be shortened in order to maintain the same electrical length, matching, and performances of the basic (original) amplifier. To confirm the validity of this idea, two amplifiers, one of which is designed using a conventional microstrip line and the other is reduced using DGS, are fabricated, measured, and compared. The performance of the reduced amplifier with DGS is quite similar to that of the basic amplifier, even though the series microstrip lines with DGS are much smaller than those of the basic amplifier by 53.8% and 55.6% at input and output matching networks, respectively.
  • Keywords
    HEMT circuits; impedance matching; microstrip circuits; microstrip lines; microwave amplifiers; periodic structures; slow wave structures; defected ground structure; effective inductive component; general purpose HEMT device amplifier; input matching networks; microstrip line electrical length; microstrip line ground plane; microwave amplifiers; output matching networks; periodic structures; size reduction; slow-wave characteristics; very high impedance microstrip line; Associate members; Dielectric substrates; Distributed amplifiers; Impedance matching; Microstrip components; Microwave amplifiers; Microwave theory and techniques; Performance evaluation; Periodic structures; Power transmission lines;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2002.801139
  • Filename
    1016817