Title :
Delay-fault testability preservation of the concurrent decomposition and factorization transformations
Author :
El-Maleh, Aiman H. ; Rajski, Janusz
Author_Institution :
Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
fDate :
5/1/1995 12:00:00 AM
Abstract :
In this paper, we study the testability preservation of the concurrent decomposition and factorization transformations under several delay-fault testing constraints. We show that all transformations, except dual extraction of multiplexor structures, preserve testability with respect to a general Robust Path-Delay-Fault (RPDF) test set, Validatable Nonrobust (VNR) delay-fault test set, and Delay Verification (DV) test set. In addition, we provide new, sufficient conditions for the algebraic resubstitution with complement transformation to preserve RPDF, VNR, and DV testability, that cover a larger class of complementary expressions than was known previously. Experimental results on a set of Berkeley PLA´s and MCNC benchmark circuits show that dual extraction of multiplexor structures is utilized in only 2 out of 50 benchmark circuits. We demonstrate that while disabling this transformation has negligible effect on area, it results in an efficient test-set preserving multilevel logic synthesis algorithm, that preserves testability with respect to RPDF, VNR, and DV test sets
Keywords :
delays; design for testability; fault diagnosis; logic design; logic testing; multivalued logic; algebraic resubstitution; concurrent decomposition; delay verification test set; delay-fault testability preservation; delay-fault testing constraints; dual extraction; factorization transformations; multilevel logic synthesis algorithm; multiplexor structures; robust path-delay-fault test set; validatable nonrobust delay-fault test set; Benchmark testing; Circuit faults; Circuit synthesis; Circuit testing; Integrated circuit manufacture; Integrated circuit synthesis; Logic testing; Propagation delay; Robustness; Sufficient conditions;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on