Title :
Foreword contributions from the 51st electronic components and technology conference
Author :
Caggiano, Michael
Author_Institution :
Rutgers University
Keywords :
Aerospace electronics; Circuit simulation; Clocks; Electronic components; Electronics packaging; Paper technology; Printed circuits; RF signals; Radio frequency; Wafer scale integration;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2002.1017677
