DocumentCode :
780175
Title :
Foreword
Author :
Boudreau, B.
Author_Institution :
Corning Incorporated
Volume :
25
Issue :
1
fYear :
2002
Firstpage :
35
Lastpage :
35
Keywords :
Detectors; High speed optical techniques; Optical distortion; Optical interconnections; Optical sensors; Packaging; Sensor arrays; Smart pixels; Space technology; Welding;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2002.1017682
Filename :
1017682
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=780175
