Title :
Development of a high density pixel multichip module at Fermilab
Author :
Cardoso, Guilherme ; Zimmermann, Sergio ; Andresen, Jeffry ; Appel, Jeffrey A. ; Chiodini, Gabriele ; Cihangir, Selcuk ; Christian, David C. ; Hall, Bradley K. ; Hoff, Jim ; Kwan, Simon W. ; Mekkaoui, Abderrezak ; Yarema, Raymond J.
Author_Institution :
Fermi Nat. Accel. Lab., Batavia, IL, USA
fDate :
2/1/2002 12:00:00 AM
Abstract :
At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The backs of the ICs are in thermal contact with the supporting structure, while the tops are flip-chip bump bonded to a pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bonded to the circuit. The BTeV pixel detector is based on a design relying on this hybrid approach. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance characteristics of the pixel module prototypes
Keywords :
electric sensing devices; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; lead bonding; multichip modules; particle detectors; readout electronics; BTeV experiment; BTeV pixel detector; Fermilab; Si; data rate; development process flexibility; fabrication technologies; flip-chip bump bonded ICs; high density pixel multichip module; low mass flex-circuit interconnect; module layers; performance characteristics; pixel detector multichip module; pixel module prototypes; pixel sensor; readout integrated circuits; sensor hybridization; sensor material; single silicon pixel sensor; supporting structure; thermal contact; wire-bonded readout IC pads; Assembly; Bonding; Detectors; Fabrication; Flexible printed circuits; Integrated circuit interconnections; Multichip modules; Prototypes; Sensor phenomena and characterization; Thermal sensors;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2002.1017683
