DocumentCode :
78022
Title :
Parallel-Distributed Block-LIM for Transient Simulation of Tightly Coupled Transmission Lines
Author :
Inoue, Yasuyuki ; Sekine, Taku ; Asai, Hiroki
Author_Institution :
Dept. of Syst. Eng., Shizuoka Univ., Hamamatsu, Japan
Volume :
3
Issue :
4
fYear :
2013
fDate :
Apr-13
Firstpage :
670
Lastpage :
677
Abstract :
In this paper, the parallel-distributed block-latency insertion method (block-LIM) is proposed for the fast transient analysis of a large-scale circuit that includes lots of coupling elements, such as mutual inductance and mutual capacitance. A conventional SPICE-like simulator requires an enormous cost for transient analysis of large-scale equivalent network that includes tightly coupled transmission lines, which is derived by using well-established commercially based extractors. The proposed method is based on the leapfrog algorithm, and can efficiently analyze tightly coupled transmission lines. First, the original LIM and the block-LIM are reviewed briefly. Next, the parallel-distributed block-LIM is proposed for the fast transient simulation and is implemented on the personal-computer-cluster system. Finally, some numerical results are shown, and it is confirmed that the proposed technique is useful and efficient for the simulations of the tightly coupled transmission lines.
Keywords :
SPICE; circuit simulation; coupled transmission lines; equivalent circuits; microcomputers; pattern clustering; transient analysis; SPICE-like simulator; large-scale equivalent circuit network; latency insertion method; leapfrog algorithm; mutual capacitance; mutual inductance; parallel-distributed block-LIM; personal-computer-cluster system; tightly coupled transmission line element; transient simulation; well-established commercially based extractor; Capacitance; Inductance; Integrated circuit modeling; Mathematical model; Topology; Transient analysis; Transmission line matrix methods; Block-latency insertion method (block-LIM); fast circuit simulation; parallel computing; tightly coupled transmission lines; transient analysis;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2230687
Filename :
6472788
Link To Document :
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