DocumentCode
78022
Title
Parallel-Distributed Block-LIM for Transient Simulation of Tightly Coupled Transmission Lines
Author
Inoue, Yasuyuki ; Sekine, Taku ; Asai, Hiroki
Author_Institution
Dept. of Syst. Eng., Shizuoka Univ., Hamamatsu, Japan
Volume
3
Issue
4
fYear
2013
fDate
Apr-13
Firstpage
670
Lastpage
677
Abstract
In this paper, the parallel-distributed block-latency insertion method (block-LIM) is proposed for the fast transient analysis of a large-scale circuit that includes lots of coupling elements, such as mutual inductance and mutual capacitance. A conventional SPICE-like simulator requires an enormous cost for transient analysis of large-scale equivalent network that includes tightly coupled transmission lines, which is derived by using well-established commercially based extractors. The proposed method is based on the leapfrog algorithm, and can efficiently analyze tightly coupled transmission lines. First, the original LIM and the block-LIM are reviewed briefly. Next, the parallel-distributed block-LIM is proposed for the fast transient simulation and is implemented on the personal-computer-cluster system. Finally, some numerical results are shown, and it is confirmed that the proposed technique is useful and efficient for the simulations of the tightly coupled transmission lines.
Keywords
SPICE; circuit simulation; coupled transmission lines; equivalent circuits; microcomputers; pattern clustering; transient analysis; SPICE-like simulator; large-scale equivalent circuit network; latency insertion method; leapfrog algorithm; mutual capacitance; mutual inductance; parallel-distributed block-LIM; personal-computer-cluster system; tightly coupled transmission line element; transient simulation; well-established commercially based extractor; Capacitance; Inductance; Integrated circuit modeling; Mathematical model; Topology; Transient analysis; Transmission line matrix methods; Block-latency insertion method (block-LIM); fast circuit simulation; parallel computing; tightly coupled transmission lines; transient analysis;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2230687
Filename
6472788
Link To Document