Title :
Laser welding induced alignment distortion in butterfly laser module packages: effect of welding sequence
Author :
Lin, Yaomin ; Liu, Wenning ; Shi, Frank G.
Author_Institution :
OptoElectronics Packaging & Autom. Lab., California Univ., Irvine, CA, USA
fDate :
2/1/2002 12:00:00 AM
Abstract :
Welding-induced-alignment-distortion (WIAD) is a serious issue in fiber-optic component attachment using laser welding, which can significantly affect the packaging yield. Elimination or minimization of WIAD is expected to be possible if the laser welding process and all relevant packaging parameters can be optimized. The effect of laser welding sequence on WIAD for butterfly laser diode packages is reported for the first time in this work. The results demonstrate that WIAD deduction can be as high as 96% if an appropriate welding sequence is employed
Keywords :
finite element analysis; laser beam welding; optical fibre fabrication; semiconductor device packaging; semiconductor lasers; thermal stresses; WIAD deduction; butterfly laser diode packages; butterfly laser module packages; fiber-optic component attachment; finite element analysis; laser welding induced alignment distortion; laser welding sequence; packaging yield; unstable coupled thermal stress problem; Diode lasers; Fiber lasers; Finite element methods; Laser beams; Laser modes; Laser noise; Optical coupling; Optical fibers; Packaging; Welding;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2002.1017688
