DocumentCode :
780248
Title :
The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits
Author :
Schwab, Daniel J. ; Randall, Barbara ; Zabinski, Patrick J. ; Schaefer, Timothy M. ; Gilbert, Barry K.
Author_Institution :
Special Purpose Processor Dev. Group, Mayo Found., Rochester, MN, USA
Volume :
25
Issue :
1
fYear :
2002
fDate :
2/1/2002 12:00:00 AM
Firstpage :
79
Lastpage :
91
Abstract :
An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X band (8 to 12 GHz). A seven-chip circuit using digital components on a Gore MCM-L was successfully tested up to 9.6 GHz. An analog-to-digital converter on an MCM-L was successfully tested up to 6 GHz. An extensive characterization of the MCM-L technology using both simulations and measurements was performed to formulate a set of design guidelines for high-frequency applications. A novel dielectric-encapsulated MCM-to-MCM interconnect scheme was proposed and tested
Keywords :
MESFET integrated circuits; S-parameters; analogue-digital conversion; integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; mixed analogue-digital integrated circuits; multichip modules; radar receivers; 6 GHz; 8 to 12 GHz; 9-GHz digital multichip circuit packaging; 9.6 GHz; GaAs MESFET; Gore MCM-L; MCM-L technology; S-parameter measurements; X-band digital radar receivers; analog-to-digital converter; design guidelines; dielectric-encapsulated MCM-to-MCM interconnect scheme; frequency-domain performance; high-frequency performance; laminate multichip module technology; low-power source-coupled FET logic configuration; mixed-signal function; seven-chip circuit; simulations; wire bonds; Analog-digital conversion; Appropriate technology; Circuit simulation; Circuit testing; Dielectric measurements; Laminates; Multichip modules; Packaging; Performance evaluation; Radar;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2002.1017689
Filename :
1017689
Link To Document :
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