• DocumentCode
    780709
  • Title

    Simulation aided hardening of N-channel power MOSFETs to prevent single event burnout

  • Author

    Dachs, Charles ; Roubaud, Franck ; Palau, Jean Marie ; Bruguier, Guy ; Gasiot, Jean ; Tastet, Pierre ; Calvet, Marie-Catherine ; Calvel, Philippe

  • Author_Institution
    Centre d´´Electron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
  • Volume
    42
  • Issue
    6
  • fYear
    1995
  • fDate
    12/1/1995 12:00:00 AM
  • Firstpage
    1935
  • Lastpage
    1939
  • Abstract
    2D MEDICI simulator is used to investigate hardening solutions to single-event burnout (SEE). SEE parametric dependencies such as carrier lifetime reduction, base enlargement, and emitter doping decrease have been verified and a p+ plug modification approach for SEE hardening of power MOSFETs is validated with simulations on actual device structures
  • Keywords
    carrier lifetime; digital simulation; doping profiles; ion beam effects; power MOSFET; radiation hardening (electronics); semiconductor device models; semiconductor doping; 2D MEDICI simulator; N-channel power MOSFETs; SEE parametric dependencies; base enlargement; carrier lifetime reduction; device structures; emitter doping decrease; p+ plug modification approach; radiation hardening solutions; simulation aided hardening; single event burnout; Bipolar transistors; Charge carrier lifetime; Computational modeling; Discrete event simulation; Doping; MOSFETs; Medical simulation; Plugs; Semiconductor process modeling; Silicon;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.489237
  • Filename
    489237