DocumentCode :
78079
Title :
A Monolithic CMOS-MEMS Oscillator Based on an Ultra-Low-Power Ovenized Micromechanical Resonator
Author :
Ming-Huang Li ; Chao-Yu Chen ; Cheng-Syun Li ; Chi-Hang Chin ; Sheng-Shian Li
Author_Institution :
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume :
24
Issue :
2
fYear :
2015
fDate :
Apr-15
Firstpage :
360
Lastpage :
372
Abstract :
A fully monolithic complimentary metal-oxide- semiconductor-microelectormechanical systems (CMOS-MEMS) oscillator comprised of an ovenized double-ended tuning fork resonator to enable ultra-low heater power operation of only 0.47 mW over entire temperature span (-40 °C to 85 °C) and a low noise sustaining circuit to achieve low phase noise has been demonstrated in a Taiwan Semiconductor Manufacturing Company (TSMC) 0.35-μm CMOS process. The combination of low thermal conductivity material and high thermal isolation design is the key to attaining ultra-low-power heater operation in a sub-mW level. Passive temperature compensation scheme is also conducted in the proposed CMOS-MEMS resonator by an oxide-metal composite structure, showing a low temperature coefficient of frequency (TC f ) of only +5.1 ppm/°C, which is suited for the use in ovenized oscillator systems. By implementing a constant-resistance temperature control scheme, the frequency drift of the resonator smaller than 120 ppm from -40 °C to 85 °C is demonstrated in this paper, indicating an equivalent TC f smaller than 1 ppm/°C, a record-low value against its CMOSMEMS counterparts. The CMOS-MEMS oscillator operating at 1.2 MHz demonstrates a phase noise of -112 dBc/Hz at 1-kHz offset and -120 dBc/Hz at 1-MHz offset while drawing less than 1.3 mW. The entire power consumption of the ovenized oscillator system is confirmed to be less than 1.8 mW (oscillator + micro-oven), verifying the great potential of low power oven-controlled MEMS oscillators realized in CMOS-MEMS technology.
Keywords :
CMOS analogue integrated circuits; low-power electronics; micromechanical resonators; oscillators; temperature control; thermal conductivity; Passive temperature compensation scheme; TSMC CMOS process; complimentary metal-oxide-semiconductor-microelectormechanical systems; constant-resistance temperature control scheme; double-ended tuning fork resonator; frequency 1.2 MHz; frequency drift; high thermal isolation design; low noise sustaining circuit; low thermal conductivity material; monolithic CMOS-MEMS oscillator; oxide-metal composite structure; size 0.35 mum; temperature -40 degC to 85 degC; ultralow heater power operation; ultralow-power ovenized micromechanical resonator; Heating; Micromechanical devices; Oscillators; Resonant frequency; Temperature sensors; Thermal resistance; CMOS-MEMS; analog integrated circuit; micro oven; microresonator; monolithic integration; oscillator; phase noise; phase noise.; temperature compensation;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2014.2331497
Filename :
6847690
Link To Document :
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