DocumentCode :
780935
Title :
Sub-30-nm FUSI CMOS Transistors Fabricated by Simple Method Without Additional CMP Process
Author :
Fukutome, Hidenobu ; Hosaka, Kimihiko ; Kawamura, Kazuo ; Ohta, Hiroyuki ; Uchino, Yasunori ; Akiyama, Shinichi ; Aoyama, Takayuki
Author_Institution :
Fujitsu Labs. Ltd., Tokyo
Volume :
29
Issue :
7
fYear :
2008
fDate :
7/1/2008 12:00:00 AM
Firstpage :
765
Lastpage :
767
Abstract :
We fabricated sub-30-nm fully silicide (FUSI) CMOS transistors by a simple method without additional chemical-mechanical-polish and gate-capping-layer processes. The FUSI draped with source/drain (S/D) capping layer (D-FUSI) featuring shallow S/D Ni silicided layer without modulation of geometric structures is suitable to improve electrical characteristics of the short-channel transistor. Drive currents of 25-nm D-FUSI CMOS transistors increased by 15% more than those of the control.
Keywords :
CMOS integrated circuits; transistors; drive currents; electrical characteristics; fully silicide CMOS transistors; short-channel transistor; source-drain capping layer; sub30-nm FUSI CMOS transistors; CMOS process; CMOS technology; Chemical processes; Electric variables; Etching; Fabrication; Impurities; MOSFETs; Protection; Silicides; CMOS; fully silicide (FUSI);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.2000915
Filename :
4558110
Link To Document :
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