DocumentCode
78098
Title
Asymmetric Dual-Spacer Trigate FinFET Device-Circuit Codesign and Its Variability Analysis
Author
Pal, Pankaj Kumar ; Kaushik, Brajesh Kumar ; Dasgupta, Sudeb
Author_Institution
Dept. of Electron. & Commun., IIT Roorkee, Roorkee, India
Volume
62
Issue
4
fYear
2015
fDate
Apr-15
Firstpage
1105
Lastpage
1112
Abstract
High-
spacer materials have been extensively studied nowadays for the enhancement of electrostatic control and suppression of short-channel effects in nanoscaled devices. However, the exorbitant increase in fringe capacitance due to high-
spacers deteriorates the dynamic circuit performance. Interestingly, this paper demonstrates effective reduction in circuit delay with an optimum usage of high-
spacer material. An asymmetric dual-
spacer trigate (ADS-TG) FinFET architecture is employed for the purpose. From extensive 3-D simulations, it is demonstrated that ADS-TG device significantly improves the overall circuit delay and robustness performance while fully capturing the fringe capacitance effects. A FinFET inverter and a three-stage ring oscillator (RO3) are adopted to investigate the performances carefully. In comparison with the conventional device, the ADS-TG device speeds up the RO3 circuit by 22.6% and 32.4% using high-
spacer dielectrics HfO2 and TiO2, respectively. Contradictorily, a purely high-
FinFET device deteriorates the RO3 delay per stage up to 11%. Furthermore, the effects of supply voltage and underlap length on ADS-TG-based RO3 delay over the conventional ones are also dealt in. The ADS-TG device and static RAM based on this device prove to be more variation tolerant in comparison with the conventional configurations.
Keywords
MOSFET; hafnium compounds; high-k dielectric thin films; integrated circuit design; nanoelectronics; titanium compounds; ADS-TG FinFET architecture; ADS-TG device; FinFET inverter; HfO2; RO3 circuit; TiO2; asymmetric dual-spacer trigate FinFET device; circuit codesign; circuit delay; electrostatic control; fringe capacitance effects; high-k FinFET device; high-k spacer materials; nanoscaled devices; short-channel effects suppression; static RAM; three-stage ring oscillator; Capacitance; FinFETs; High K dielectric materials; Inverters; Logic gates; Permittivity; Asymmetric structure; FinFETs; dual dielectric; fringe capacitance; high- $k$ materials; high-k materials; inverter delay; noise margins (NMs); power supply scalability; ring oscillator; short-channel effects; spacer engineering; underlap devices; underlap devices.;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2015.2400053
Filename
7047795
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