DocumentCode :
781025
Title :
Will microengineering affect your business
Author :
Santilli, R.
Author_Institution :
Appl. Microengineering Ltd., Bourne End, UK
Volume :
6
Issue :
2
fYear :
1995
fDate :
4/1/1995 12:00:00 AM
Firstpage :
93
Lastpage :
97
Abstract :
Microengineering technology is leaving the research laboratories and has come of age. The article gives a flavour of its benefits, opportunities, and applications. It also discusses how industry can bring onboard and incorporate this important strategic technology into its products. Microengineering enables: the production of smaller, lighter, and faster versions of existing mechanical devices, with increased dimensional accuracy, e.g micromotors; the production of sensors, mainly exploiting the electromechanical properties of silicon, where electrical characteristics change in response to a change in a particular external parameter, e.g. temperature, pressure, acceleration, humidity and radiation; the use of materials and processes common to integrated microelectronics with micromechanical components, thus bringing about improvements in performance and cost; batch processing to fabricate large volumes of miniature components at low cost, e.g ink jet nozzles; the opportunity to extend process technology to include materials and techniques not used in microelectronics, but which offer specific advantages to micromechanical devices, e.g. LIGA; the economic integrated manufacture of complete systems to include sensing, computation and actuation.<>
Keywords :
micromachining; micromechanical devices; microsensors; batch processing; business; economic integrated manufacture; electromechanical properties; integrated microelectronics; mechanical devices; microelectronics; microengineering technology; micromechanical components; micromechanical devices; micromotors; miniature components; process technology; sensors; strategic technology; Microelectromechanical devices; Micromachining; Microsensors;
fLanguage :
English
Journal_Title :
Computing & Control Engineering Journal
Publisher :
iet
ISSN :
0956-3385
Type :
jour
DOI :
10.1049/cce:19950206
Filename :
386058
Link To Document :
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