Impedance criterion for power modules comparison

Author

Schanen, Jean-Luc ; Martin, Christian ; Frey, David ; Pasterczyk, Robert-J

Author_Institution

Lab. d´´Electrotechnique de Grenoble, CNRS UMR, St. Martin d´´Heres, France

Volume

21

Issue

1

fYear

2006

Firstpage

18

Lastpage

26

Abstract

It is well known that power modules must exhibit as low as possible stray inductance. However, the total inductance of a power module is not the only parameter to indicate the electrical quality of the packaging. In this paper, mathematical criteria will be given, which will allow the evaluation of power modules interconnects with regard to several objectives: equal current constraints among the different paralleled dies, power-drive, and even drive-drive interactions.

Keywords

driver circuits; drive-drive interactions; equal current constraints; impedance criterion; mathematical criteria; packaging electrical quality; parallel dies; power drives; power modules comparison; stray inductance; Conductors; Coupling circuits; Equivalent circuits; Impedance; Inductance; Insulated gate bipolar transistors; Integrated circuit interconnections; Multichip modules; Packaging; Solid modeling; Paralleling devices; parasitic impedance; power modules; power-drive interactions;

fLanguage

English

Journal_Title

Power Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0885-8993

Type

jour

DOI

10.1109/TPEL.2005.861112

Filename

1566685