Title :
Extended operation of flying capacitor multilevel inverters
Author :
Huang, Jing ; Corzine, Keith A.
Author_Institution :
Dept. of Electr. Eng., Univ. of Missouri, Rolla, MO, USA
Abstract :
Recent research in flying capacitor multilevel inverters (FCMIs) has shown that the number of voltage levels can be extended by changing the ratio of the capacitor voltages. For the three-cell FCMI, four levels of operation are expected if the traditional ratio of the capacitor voltages is 1:2:3. However, by altering the ratio, the inverter can operate as a five-, six-, seven-, or eight-level inverter. According to previous research, the eight-level case is referred to as maximally distended (or full binary combination schema) since it utilizes all possible transistor switching states. However, this case does not have enough per-phase redundancy to ensure capacitor voltage balancing under all modes of operation. In this paper, redundancy involving all phases is used along with per-phase redundancy to improve capacitor voltage balancing. It is shown that the four- and five-level cases are suitable for motor drive operation and can maintain capacitor voltage balance under a wide range of power factors and modulation indices. The six-, seven-, and eight-level cases are suitable for reactive power transfer in applications such as static var compensation. Simulation and laboratory measurements verify the proposed joint-phase redundancy control.
Keywords :
invertors; motor drives; power capacitors; reactive power; static VAr compensators; switching convertors; capacitor voltage balancing; flying capacitor multilevel inverters; joint-phase redundancy control; modulation indices; motor drive operation; power factors; reactive power transfer; static Var compensation; transistor switching states; Capacitors; Differential equations; Diodes; Inverters; Kirchhoff´s Law; Motor drives; Power quality; Reactive power; Topology; Voltage; Converter; flying capacitor; inverter; multilevel; rectifier; voltage balancing;
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2005.861108