Modeling SiGe FinFETs With Thin Fin and Current-Dependent Source/Drain Resistance

In this letter, we model future generation SiGe FinFETs using the industry standard compact model BSIM-CMG. BSIM-CMG is enhanced to model these aggressively scaled devices. It is found that in these narrow fin (fin width W_fin = 12 nm) devices spacer region resistance behaves nonlinearly with drain-current. This nonlinear resistance behavior arises due to the saturation of carrier velocity in the spacer region. Accurate modeling of spacer region nonlinearity is important to predict the drain-current and the device transconductance. The developed model captures this phenomenon very well and produces excellent agreement with experimental data.