Title :
Analysis of a multilayered-metal thin-film transmission line
Author :
Hwang, Lih-Tyng ; Rinne, Glenn A. ; Turlik, Iwona
Author_Institution :
Adv. Interconnect Syst. Labs., Motorola Inc., Tempe, AZ, USA
fDate :
5/1/1995 12:00:00 AM
Abstract :
In this study, a perturbed-TEM analysis was conducted on a two-wire transmission line with a two-layered metal system that represents a typical metallurgy used in thin-film multichip modules (MCM´s). Closed-form solutions were obtained for the current density, resistance, inductance, attenuation, and phase velocity. The proximity effects were clearly illustrated in the current density plots. It was shown that the increase in the attenuation and the resistance was caused by the skin effect and the power loss in the cladding conductor (copper line clad with 0.1-μm thick chromium), and the increase (decrease) in the phase velocity (internal inductance) of the thin-film lines was caused by the penetration of the magnetic field into the conductors
Keywords :
current density; losses; multichip modules; skin effect; transmission lines; Cu-Cr; attenuation; cladding conductor; current density; current density plots; inductance; magnetic field penetration; multilayered-metal thin-film transmission line; perturbed-TEM analysis; phase velocity; power loss; proximity effects; resistance; skin effect; thin-film multichip modules; two-wire transmission line; Attenuation; Closed-form solution; Conductive films; Current density; Inductance; Multichip modules; Power transmission lines; Proximity effect; Transistors; Transmission lines;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
