Title :
Low-cost 10-gb/s optical receiver module using a novel plastic package and a passive alignment technique
Author :
Kurosaki, Takeshi ; Shuto, Yoshito ; Tadokoro, T. ; Yokoyama, Kenji ; Endo, Jun ; Amano, Michiyuki ; Nakamura, Makoto ; Ishihara, Noboru ; Suzuki, Yasuhiro
Author_Institution :
Nippon Telegraph & Telephone, NTT Corp., Kanagawa, Japan
Abstract :
A new low-cost 10-Gb/s optical receiver module constructed using a novel plastic package is proposed. Passive alignment using a glass V-groove substrate and an edge-illuminated refracting-facet photodiode (RFPD) was employed to reduce cost. Instead of a conventional GaAs IC, a Si-bipolar preamplifier IC was mounted on the package to reduce power consumption. High-speed signal lines with a bandwidth of more than 10 GHz were realized using a three-dimensional electromagnetic-field analysis. For the fabricated module, a 3-dB detection bandwidth of 7.7 GHz and a sensitivity of less than -14 dBm at 10 Gb/s were achieved. To confirm the reliability of the fabricated module, a damp-heat test without bias voltage and a temperature-cycling test were performed. The results show that the optical receiver module, if covered with silicone resin, has the ability to withstand humidity and thermal stress.
Keywords :
III-V semiconductors; bipolar integrated circuits; elemental semiconductors; gallium arsenide; integrated optoelectronics; light refraction; optical fibre communication; optical receivers; optical testing; packaging; photodiodes; plastics; reliability; silicon; 10 Gbit/s; 7.7 GHz; GaAs; GaAs IC; Si; Si-bipolar preamplifier IC; damp-heat test; edge-illuminated photodiode; glass V-groove substrate; high-speed signal lines; humidity; optical receiver module; passive alignment; plastic package; refracting-facet photodiode; reliability; silicone resin; temperature-cycling test; thermal stress; three-dimensional electromagnetic field analysis; Bandwidth; Costs; Electromagnetic refraction; Glass; Optical receivers; Optical refraction; Photodiodes; Plastic packaging; Testing; Thermal stresses; 10-Gb/s transmission; Edge-illuminated refracting-facet photodiode (RFPD); Si-bipolar preamplifier IC; glass V-groove substrate; low-cost optical module; passive alignment; plastic package;
Journal_Title :
Lightwave Technology, Journal of
DOI :
10.1109/JLT.2005.858218