Title :
High-Performance Low-Cost 10-Gb/s Coaxial DFB Laser Module Packaging by Conventional TO-Can Materials and Processes
Author :
Shih, Tien-Tsorng ; Lin, Min-Ching ; Cheng, Wood-Hi
Author_Institution :
Dept. of Electron. Eng., Nat. Kaohsiung Univ. of Appl. Sci.
Abstract :
High-performance low-cost 10-Gb/s coaxial DFB laser module packages made by conventional TO-Can materials and processes are developed and fabricated. The laser module has a built-in matching resistor to reduce the resonant phenomenon. In order to optimize the module´s performance, a detailed equivalent circuit model is established to investigate both the DFB laser diode and the coaxial package comprehensively. This uncooled 10-Gb/s laser module operates at a high temperature of up to 105degC, and maintains an eye mask margin above 28% in the full operational temperature range to meet the stringent requirements of 10-Gb/s Ethernet for long-reach applications. This paper demonstrates that it is possible to fabricate cost-effective packages using existing low-cost TO-Can package technology while maintaining the high performance of the 10-Gb/s coaxial laser modules. Previously, the high-performance 10-Gb/s coaxial laser modules have only been available by using complicated design, customized components, and specialized fabrication process
Keywords :
distributed feedback lasers; electronics packaging; modules; optical communication equipment; optical fabrication; optical fibre LAN; semiconductor lasers; 10 Gbit/s; DFB laser module packaging; Ethernet; TO-Can materials; equivalent circuit model; eye mask margin; matching resistor; Coaxial components; Diode lasers; Equivalent circuits; Ethernet networks; Laser modes; Optical materials; Packaging; Resistors; Resonance; Temperature distribution; 10-Gb/s coaxial DFB laser module; Equivalent circuit model; low-cost module;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2006.879532