Title :
Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array
Author :
Ogawa, Ikuo ; Doi, Yoshiyuki ; Hashizume, Yasuaki ; Kamei, Shin ; Tamura, Yasuaki ; Ishii, Motohaya ; Kominato, Toshimi ; Yamazaki, Hiroshi ; Kaneko, Akimasa
Author_Institution :
NTT Photonics Labs., Kanagawa
Abstract :
We have developed an ultra-small 16-channel variable optical attenuator (VOA) multiplexer (V-AWG) with excellent optical performance by using multichip planar lightwave circuit (PLC) integration technology. The insertion loss is 3.2 dB, and the polarization-dependent loss (PDL) at 25 dB attenuation is less than 0.3 dB. The module size is 90 mmtimes55 mmtimes14 mm. We describe our concept and developed techniques as regards to the design, fabrication, and packaging of the module, focusing particularly on a chip-scale-packaged monitor photodiode array (CSP-PD) that we developed as a key component of our technique
Keywords :
modules; multiplexing equipment; optical arrays; optical attenuators; optical communication equipment; optical losses; optical planar waveguides; photodiodes; 14 mm; 3.2 dB; 55 mm; 90 mm; chip-scale-packaged monitor photodiode array; insertion loss; module; multichip planar lightwave circuit; packaging; polarization-dependent loss; variable optical attenuator multiplexer; Chip scale packaging; Circuits; Insertion loss; Integrated optics; Multiplexing; Optical arrays; Optical attenuators; Optical losses; Optical polarization; Programmable control; Chip-scale-package photodiode (PD) array; multichip planar lightwave circuit (PLC) integration; silica-based PLC; variable optical attenuator multiplexer;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2006.882627
