DocumentCode
7826
Title
Investigation on the Response of TaO
-based Resistive Random-Access Memories to Heavy-Ion Irradiation
Author
Fei Tan ; Ru Huang ; Xia An ; Yimao Cai ; Yue Pan ; Weikang Wu ; Hui Feng ; Xing Zhang ; Yangyuan Wang
Author_Institution
Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
Volume
60
Issue
6
fYear
2013
fDate
Dec. 2013
Firstpage
4520
Lastpage
4525
Abstract
Impact of heavy-ion irradiation on the TaOx-based resistive random-access memory (RRAM) is investigated in this work. After Br ion irradiation, the set voltage of TaOx-based RRAM shows slight change, and negative shift of the forming voltage is observed. For the resistance change of TaOx-based RRAM devices induced by irradiation, the resistance of the low resistance state (LRS) illustrates acceptable change, while the resistance of the high resistance state (HRS) is quite sensitive to heavy ion irradation. Some irradiated devices even change from the HRS into the LRS, which results in disappeared memory window and may be attributed to the displacement damage in the dielectric layer. These results indicate that TaOx-based RRAM devices need to be carefully designed for future space applications.
Keywords
radiation hardening (electronics); random-access storage; tantalum compounds; HRS; LRS; RRAM; TaOx; dielectric layer; disappeared memory window; heavy-ion irradiation; high resistance state; low resistance state; resistive random-access memories; Dielectrics; Ions; Radiation effects; Resistance; Weibull distribution; HRS; Heavy-ion irradiation; LRS; RRAM;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2013.2287615
Filename
6678327
Link To Document