• DocumentCode
    7826
  • Title

    Investigation on the Response of TaO _{\\rm x} -based Resistive Random-Access Memories to Heavy-Ion Irradiation

  • Author

    Fei Tan ; Ru Huang ; Xia An ; Yimao Cai ; Yue Pan ; Weikang Wu ; Hui Feng ; Xing Zhang ; Yangyuan Wang

  • Author_Institution
    Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
  • Volume
    60
  • Issue
    6
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    4520
  • Lastpage
    4525
  • Abstract
    Impact of heavy-ion irradiation on the TaOx-based resistive random-access memory (RRAM) is investigated in this work. After Br ion irradiation, the set voltage of TaOx-based RRAM shows slight change, and negative shift of the forming voltage is observed. For the resistance change of TaOx-based RRAM devices induced by irradiation, the resistance of the low resistance state (LRS) illustrates acceptable change, while the resistance of the high resistance state (HRS) is quite sensitive to heavy ion irradation. Some irradiated devices even change from the HRS into the LRS, which results in disappeared memory window and may be attributed to the displacement damage in the dielectric layer. These results indicate that TaOx-based RRAM devices need to be carefully designed for future space applications.
  • Keywords
    radiation hardening (electronics); random-access storage; tantalum compounds; HRS; LRS; RRAM; TaOx; dielectric layer; disappeared memory window; heavy-ion irradiation; high resistance state; low resistance state; resistive random-access memories; Dielectrics; Ions; Radiation effects; Resistance; Weibull distribution; HRS; Heavy-ion irradiation; LRS; RRAM;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2013.2287615
  • Filename
    6678327