Title :
Low-temperature Pyrex glass wafer direct bonding
Author :
Pigeon, F. ; Biasse, B. ; Zussy, M.
Author_Institution :
LETI, CEA, Centre d´´Etudes Nucleaires, de Grenoble, France
fDate :
5/11/1995 12:00:00 AM
Abstract :
The authors focus on the low-temperature direct bonding of Pyrex glass wafers. A hydrophilic treatment has been used to decrease the process temperature. After a final heat treatment at 350°C, a tensile strength of ~250 kgf/cm2 has been measured. This technique can be used to create a three dimensional integrated optical structure by bonding together several optical devices made by K+ ion exchange in Pyrex glass
Keywords :
integrated optics; optical fabrication; wafer bonding; 350 degC; K+ ion exchange; Pyrex glass; heat treatment; hydrophilic treatment; low-temperature direct bonding; optical devices; process temperature; tensile strength; three dimensional integrated optical structure; wafer direct bonding;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19950554
