• DocumentCode
    782741
  • Title

    Low-temperature Pyrex glass wafer direct bonding

  • Author

    Pigeon, F. ; Biasse, B. ; Zussy, M.

  • Author_Institution
    LETI, CEA, Centre d´´Etudes Nucleaires, de Grenoble, France
  • Volume
    31
  • Issue
    10
  • fYear
    1995
  • fDate
    5/11/1995 12:00:00 AM
  • Firstpage
    792
  • Lastpage
    793
  • Abstract
    The authors focus on the low-temperature direct bonding of Pyrex glass wafers. A hydrophilic treatment has been used to decrease the process temperature. After a final heat treatment at 350°C, a tensile strength of ~250 kgf/cm2 has been measured. This technique can be used to create a three dimensional integrated optical structure by bonding together several optical devices made by K+ ion exchange in Pyrex glass
  • Keywords
    integrated optics; optical fabrication; wafer bonding; 350 degC; K+ ion exchange; Pyrex glass; heat treatment; hydrophilic treatment; low-temperature direct bonding; optical devices; process temperature; tensile strength; three dimensional integrated optical structure; wafer direct bonding;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19950554
  • Filename
    386942
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=782741