Title :
Design, Simulation, Fabrication, and Characterization of a Digital Variable Optical Attenuator
Author :
Sun, Winston ; Noell, Wilfried ; Zickar, Michael ; Mughal, M. Junaid ; Perez, Frank ; Riza, Nabeel A. ; De Rooij, Nicolaas F.
Author_Institution :
IIS, Univ. of Tokyo
Abstract :
In this paper, we present the design, simulation, fabrication, and some measurement and characterization of a novel 16-bit digital variable optical attenuator (VOA) that attenuates by switching individual mirror of an array as an attempt to achieve input voltage variation independence and output linearization. The design was aided by a simulation package that features coupled electrostatic and mechanical solver. The mirror array spans an area of 1500times1500 mum2 and contains 16 equal-length rectangular micromirrors. Each mirror is suspended by two torsion beams. Experiments on beam design and width variations are conducted. Assuming Gaussian distribution, the mirror widths computed by an iteration algorithm vary from about 40 to 250 mum. Based on silicon-on-insulator (SOI) technology, two fabrication schemes to open the backside optical entrance were investigated. A hydrofluoric (HF) acid vapor-phase-etching (VPE) setup built to release the microstructure anhydrously is the key to achieve high yield especially for fragile components. Surface flatness, resonance frequencies, and tilt angles of selected mirrors were characterized. Quartz chips patterned with aluminum electrodes and 10 mum-high SU8 spacer columns were fabricated and assembled to corresponding device chips. Optical performance adversely affected by mirror bending is believed to originate from the intrinsic stress of the SOI wafer
Keywords :
Gaussian distribution; beams (structures); etching; iterative methods; micromechanical devices; micromirrors; optical attenuators; silicon-on-insulator; 10 micron; 40 to 250 micron; Gaussian distribution; beam design; eurface flatness; fabrication schemes; intrinsic stress; iteration algorithm; micro mirrors; mirror bending; optical performance; quartz chips; rectangular micromirrors; resonance frequencies; silicon-on-insulator; simulation package; tilt angles; vapor phase etching; variable optical attenuator; Attenuation measurement; Electrostatic measurements; Mirrors; Optical arrays; Optical attenuators; Optical design; Optical device fabrication; Packaging; Silicon on insulator technology; Voltage; Deep reactive ion etch (DRIE); hydrofluoric (HF) vapor-phase-etching (VPE); micro mirrors; silicon-on-insulator (SOI); variable optical attenuator (VOA);
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2006.879699