ITER TF conductor insert coil manufacture

Author

Cheverev, N. ; Glukhikh, V. ; Filatov, O. ; Belykov, V. ; Muratov, V. ; Egorov, S. ; Rodin, I. ; Malkov, A. ; Sukhanova, M. ; Gavrilov, S. ; Krylov, V. ; Mudugin, B. ; Bondarchouk, N. ; Yakubovsky, V. ; Cherdakov, A. ; Mikhailov, M. ; Konstantinov, Yu. ;

Author_Institution

Dept. of Nucl. Sci. & Technol., RF Minatom, Moscow, Russia

Volume

12

Issue

1

fYear

2002

fDate

3/1/2002 12:00:00 AM

Firstpage

548

Lastpage

553

Abstract

A single layer Toroidal Field Conductor Insert (TFCI) coil for testing at 46 kA in the 13 T background magnetic field generated by the Central Solenoid Model Coil (CSMC) of the International Thermonuclear Experimental Reactor (ITER) has been manufactured by a collaboration of Russian scientific-industrial institutions. The report contains a brief description of the technique and tooling used for the 1152 Nb₃Sn strand, thin-wall Ti jacket, 45-m length cable-in-conduit conductor manufacturing, its wounding into the coil, end bending, terminal joint preparation, heat treatment in a high-vacuum electrical oven, insulation and transfer into the spiral grooves from inside of a cylindrical stainless steel mandrel, and vacuum-pressure impregnation with epoxy.

Keywords

Tokamak devices; fusion reactor design; heat treatment; niobium compounds; plasma toroidal confinement; superconducting magnets; 13 T; 45 m; 46 kA; ITER TF conductor insert coil manufacture; International Thermonuclear Experimental Reactor; Nb₃Sn; Ti; background magnetic field; cable-in-conduit conductor; central solenoid model coil; cylindrical stainless steel mandrel; end bending; epoxy; heat treatment; high-vacuum electrical oven; spiral grooves; strand; superconductivity; terminal joint preparation; thin-wall jacket; toroidal field conductor insert; vacuum-pressure impregnation; Coils; Conductors; Inductors; International collaboration; Niobium; Solenoids; Testing; Tin; Toroidal magnetic fields; Virtual manufacturing;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2002.1018463

Filename

1018463