DocumentCode
783553
Title
Experience with high-output-resistance MJTC AC-DC transfer standards at high frequencies [multijunction thermal converters]
Author
Filipski, Piotr S. ; Boecker, Michael
Author_Institution
Inst. for Nat. Meas. Stand., Nat. Res. Council of Canada, Ottawa, Ont., Canada
Volume
52
Issue
4
fYear
2003
Firstpage
1314
Lastpage
1319
Abstract
The heater-thermopile insulation of planar, thin-film, multijunction thermal converters decreases at high frequencies due to the residual conductivity of the silicon chip. This may cause a change in their intrinsic AC-DC transfer difference, as well as an interaction with the measurement circuit, resulting in increased errors of measurements. This paper discusses the sources of these errors and the methods of their reduction. It is postulated that the AC-DC transfer differences of such converters need to be explicitly defined under specific measurement conditions.
Keywords
calibration; convertors; electric variables measurement; frequency response; measurement errors; thermopiles; transfer standards; AC-DC transfer differences; MJTC AC-DC transfer standards; calibration; electric variables measurement; heater-thermopile insulation; high-output-resistance MJTC; measurement errors; measurement standards; multijunction thermal converters; nanovoltmeter; planar thin-film thermal converters; silicon chip residual conductivity; transfer standard high frequency response; Councils; Frequency conversion; Insulation; Measurement standards; Semiconductor device measurement; Testing; Thermal conductivity; Thermal variables measurement; Transistors; Voltage;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2003.816852
Filename
1232387
Link To Document