• DocumentCode
    783553
  • Title

    Experience with high-output-resistance MJTC AC-DC transfer standards at high frequencies [multijunction thermal converters]

  • Author

    Filipski, Piotr S. ; Boecker, Michael

  • Author_Institution
    Inst. for Nat. Meas. Stand., Nat. Res. Council of Canada, Ottawa, Ont., Canada
  • Volume
    52
  • Issue
    4
  • fYear
    2003
  • Firstpage
    1314
  • Lastpage
    1319
  • Abstract
    The heater-thermopile insulation of planar, thin-film, multijunction thermal converters decreases at high frequencies due to the residual conductivity of the silicon chip. This may cause a change in their intrinsic AC-DC transfer difference, as well as an interaction with the measurement circuit, resulting in increased errors of measurements. This paper discusses the sources of these errors and the methods of their reduction. It is postulated that the AC-DC transfer differences of such converters need to be explicitly defined under specific measurement conditions.
  • Keywords
    calibration; convertors; electric variables measurement; frequency response; measurement errors; thermopiles; transfer standards; AC-DC transfer differences; MJTC AC-DC transfer standards; calibration; electric variables measurement; heater-thermopile insulation; high-output-resistance MJTC; measurement errors; measurement standards; multijunction thermal converters; nanovoltmeter; planar thin-film thermal converters; silicon chip residual conductivity; transfer standard high frequency response; Councils; Frequency conversion; Insulation; Measurement standards; Semiconductor device measurement; Testing; Thermal conductivity; Thermal variables measurement; Transistors; Voltage;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2003.816852
  • Filename
    1232387